George G. Harman
George G. Harman is an internationally acclaimed expert in the area of wirebonding and packaging of semiconductor chips. He is a former NIST Fellow and a former president of the International Microelectronics and Packaging Society (IMAPS). He is considered the world's foremost authority on wire bonding. Harman presents numerous seminars and short courses on wire bonding, packaging reliability, and acoustic emission testing in electronics. His book, Wire Bonding in Microelectronics, second edition (McGraw Hill, 1997), is considered to be the "bible" in terms of wire-bonding information. He is a Fellow of the IEEE and IMAPS and has received numerous domestic and foreign awards and recognition.
Harman is currently working, with a patent pending, on the development of materials for wire bond interconnections to semiconductor-chip structures. Harman serves as the Electronics and Electrical Engineering Laboratory's first Scientist Emeritus.
