•1.0                       Scope of Work

•1.1  Fabricate the modular based Avalanche Photo-Diode (APD) receiver system in accordance to the drawings listed in section 2.  This includes the acquisition of all components with the exception of those listed in section 3, Government Furnished Property (GFP).

•1.2  Manufacturer will be ISO 9001 or equivalent certified.

•1.3  Manufacturer will obtain all parts including printed circuit boards (PCBs), electrical components, and mechanical components. 

•1.4  Manufacturer will populate all PCBs in conformance to industry workmanship standards.

•1.5  Manufacturer will perform any and all mechanical modifications to mechanical assemblies as per drawings provided.  This includes assembly perforations and silk-screening.

•1.6  Manufacturer will assemble the backplane PCB's. Manufacturer will then assemble the rack assemblies using the backplane PCB's.

•1.7  Manufacturer will assemble the receiver PCB's. Manufacturer will then assemble the receiver assemblies using the receiver PCB's

•1.8  Manufacturer will assemble the power supply PCB's. Manufacturer will then assemble the power supply assemblies using the power supply PCB's. 

•1.9  Manufacturer will assemble a complete rack assembly by using 8 receiver assemblies and 1 power supply assembly for each rack.

•1.10                      Manufacturer will return all excess Government Furnished Property (GFP).

•1.11                      Manufacturer will provide all documents, such as component specific datasheets for Avalanche Photodiodes (D1, APD Receiver PCB Assembly #309282-02), as outlined in assembly drawings.

•1.12                      Manufacturer will fill in Revision on PCB assembly as instructed by National Security Technologies (NSTec).

•1.13                      Manufacturer will not perform any re-work or changes of any kind until proper documentation is received.

•2.0                       documentation provided to manufacturer in either paper format or electronic media files.  (H-EO-57-01)

•2.1  (309330-02)       Top Level Assembly, Rack, System, APD Low Power Receiver

•2.1.1        (308660-02) Assembly, Module, APD Receiver (H-EO-58-01)

•[1]   (309277-02) Kit, Plug-In Unit, Type 4, 3U X 7HP

•[a]    (308661-02) Front Panel, APD Receiver

•[b]   (308832-03) Cover, Module, Modified, Receiver

•[2]   (309282-02) PCB Assembly, Receiver

•[a]    (309282-01) PCB Fabrication, Receiver, APD

•[b]   (309282-02) PCB Assembly, Receiver, APD Drawing (including APD Receiver PCB Gerber files)

•[c]    (311447) Bracket, APD, Connector

•[3]   (309159) Insert, Mounting, PCB

•[4]   (311449-01) Plate, Model, Identification, H-EO-58-01

•2.1.2        (308664-02) Assembly, Power Supply, Low Power, (H-PS-18-01)

•[1]   (309246-02) Kit, Plug-In Unit, Type 5, 3U X 28 HP, Low Power

•[a]    (308665-02) Modification, Panel, Front, Low Power

•[b]   (308666) Modification, Panel, Rear, Power Supply

•[2]   (309954-02) PCB Assembly, Power Supply, Low Power

•[a]    (309954-01) PCB Fabrication, Power Supply, APD, Low Power

•[b]   (309954-02) PCB Assembly, Power Supply, APD, Low Power Drawing (including Power Supply PCB Gerber files)

•[3]   (308646) Assembly, Toroid Plate Drawing

•[a]    (308645) Plate, Toroid Mounting

•[b]   (309274) Assembly, Wire, Grounding

•[4]   (309159) Insert, Mounting, PCB Drawing

•[5]   (311460-01) Plate, Model, Identification, H-PS-18-01

•2.1.3        (308776-02) PCB Assembly, Backplane, APD Drawing

•[1]   (308776-01) PCB Fab., Backplane, APD, VISAR Drawing

•[2]   (308776-02) PCB Assembly, Backplane, APD, VISAR Drawing (including Backplane PCB Gerber files)

•2.1.4        (308777) Kit, Sub-Rack Assembly Drawing

•2.2  Additional Documents

•2.2.1        List of Government Furnished Property (GFP)

•3.0                       government furnished property

There will be no government furnished property provided on this build.

•4.0                       special requirements

•4.1  Electro-Static Discharge (ESD) precautions shall be taken by manufacturer in order to protect sensitive electrical components.  Some of these components are quite expensive and damaging them is costly.

•4.2  Each receiver will contain an avalanche photodiode.  Each diode, D1, has its own unique electrical characteristics outlined in a data sheet document that comes as part of the diode lot packaging.  The datasheet document is to be taped to the very last receiver/chassis that is assembled. The information provided in the datasheet is required to properly adjust the receivers.   KEEPING THE DATA SHEET WITH THE LAST ASSEMBLED RECEIVER/CHASSIS IS AN ABSOLUTE REQUIREMENT FOR ACCEPTANCE BY NATIONAL SECURITY TECHNOLOGIES, LLC.

•5.0                       acceptance requirements

•5.1  Requirement 4.2 must be met.

•5.2  Assemblies will be inspected before receipt by qualified National Security Technologies, LLC technician for the following:

•5.2.1        Workmanship

•[1]   No scratches

•[2]   No dents

•[3]   No unspecified markings

•5.2.2        compliance to drawings

•5.2.3        orientation of components

•5.2.4        cleanliness:

•[1]   no solder splashes

•[2]   no cold solder joints

•[3]   no solder flux