| US 7,374,620 B2 | ||
| Substrate processing apparatus | ||
| Tadahiro Ohmi, Miyagi (Japan); and Masaki Hirayama, Miyagi (Japan) | ||
| Assigned to Tokyo Electron Limited, Tokyo (Japan) | ||
| Appl. No. 10/555,770 PCT Filed Apr. 26, 2004, PCT No. PCT/JP2004/005977 § 371(c)(1), (2), (4) Date Dec. 22, 2005, PCT Pub. No. WO2004/100248, PCT Pub. Date Nov. 18, 2004. |
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| Claims priority of application No. 2003-130544 (JP), filed on May 08, 2003. | ||
| Prior Publication US 2006/0213436 A1, Sep. 28, 2006 | ||
| Int. Cl. C23C 16/00 (2006.01); C23C 16/455 (2006.01); C23F 1/08 (2006.01) | ||
| U.S. Cl. 118—715 [118/723 E; 118/723 R; 118/722; 118/723 I; 118/733; 156/345.29; 156/345.48] | 11 Claims |
| 1. A substrate processing apparatus comprising:
a processing chamber defined by an outer wall and provided with a holding table for holding a processing substrate,
an exhaust port for exhausting the inside of said processing chamber,
a microwave transmissive window provided on said processing chamber as part of said outer wall so as to face said processing
substrate,
a microwave antenna provided on said microwave transmissive window and electrically connected to a microwave power supply,
a plasma gas supply portion for supplying a plasma gas into said processing chamber,
an inner partition wall formed so as to surround said holding table, and
a partition wall attaching portion inserted between said processing chamber and said microwave transmissive window to form
part of said outer wall and attached with said inner partition wall,
said inner partition wall being directly attached to said partition wall attaching portion and said microwave transmissive
window and dividing a space inside said processing chamber into a first space containing said holding table and a second space
defined by said outer wall and said inner partition wall, and a gap between said microwave transmissive window and said partition
wall attaching portion being exhausted through said second space.
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