US 7,358,292 B2
	Relay block
Takaaki Miyoshi, Kimitsu (Japan); and Shigeki Katayama, Kawasaki (Japan)
Assigned to Asahi Kasei Chemicals Corporation, Tokyo (Japan)
Appl. No. 10/509,612 PCT Filed Apr. 02, 2003, PCT No. PCT/JP03/04210 § 371(c)(1), (2), (4) Date Sep. 30, 2004, PCT Pub. No. WO03/087225, PCT Pub. Date Oct. 23, 2003.
Claims priority of application No. 2002-100125 (JP), filed on Apr. 02, 2002.
Prior Publication US 2005/0171262 A1, Aug. 04, 2005
This patent is subject to a terminal disclaimer.
Int. Cl. C08K 3/08 (2006.01)

U.S. Cl. 524—440  [361/819; 361/833; 361/834; 523/351; 524/474]

25 Claims

1. A relay block free from melt wrinkles and comprising a resin composition which contains a polyarnide, a polyphenylene ether, a block copolymer comprising at least one polymer block mainly composed of an aromatic vinyl compound and at least one polymer block mainly composed of a conjugated diene compound, at least one transition metal selected from the group consisting of copper, nickel and cobalt and at least one halogen selected from the group consisting of chlorine, iodine and bromine, and which has a melt volume rate (MVR) [measured at a test temperature of 280° C. under a load of 5.0 kg in accordance with method B of ISO1133: 1997] of not less than 60 cm3/10 min., a dimensional change after water absorption [change of dimension in the flow direction after being subjected to water absorption treatment at a temperature of 90° C. and a humidity of 95% for 72 hours as compared with the dimension before subjecting to water absorption treatment (measured using a plate of type D2 of 2 mm thick specified in ISO294-3: 1996 which is molded at a melting temperature of 290° C. and a mold temperature of 90° C. under the molding conditions specified in ISO15103-2: 1997)] of not more than 1.0%, a reduced viscosity of polyphenylene ether in the resin composition of 0.40-0.45 dl/g, and the polyamide has a viscosity number of 100-130 ml/g measured in 96% sulfuric acid in accordance with ISO307:1994.