| US 7,401,637 B2 | ||
| Pressure-only molten metal valving apparatus and method | ||
| Glen N. Biggs, Wappingers Falls, N.Y. (US); John J. Garant, Poughkeepsie, N.Y. (US); Peter A. Gruber, Mohegan Lake, N.Y. (US); Bouwe W. Leenstra, Walden, N.Y. (US); Christopher L. Tessler, Poughquag, N.Y. (US); and Thomas Weiss, Poughkeepsie, N.Y. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Jul. 28, 2006, as Appl. No. 11/495,966. | ||
| Prior Publication US 2008/0023526 A1, Jan. 31, 2008 | ||
| Int. Cl. B22D 18/00 (2006.01) | ||
| U.S. Cl. 164—119 [164/306; 228/33] | 20 Claims |
| 1. An apparatus for dispensing a molten solder into cavities of a substrate, comprising:
a micro-hole feed solder head having a micro-hole feed plate at the bottom of said solder head containing an array of small
holes through which solder is supplied under pressure into cavities in a substrate;
a solder reservoir connected to said micro-hole feed solder head for holding said solder, wherein said micro-holes have a
diameter from about 10 microns to about 100 microns and an aspect ratio of at least about 2;
means for heating said reservoir for maintaining said solder in a molten state; and
means for supplying said solder from said reservoir to said micro-hole feed plate through a manifold structure in said micro-hole
solder head; and
means for supplying a gas at pressure to said solder head such that when said gas pressure is applied, the molten solder in
said reservoir is pushed towards the micro-hole feed plate at the bottom of said solder head through said manifold structure
thereby dispensing molten solder into cavities of said substrate.
|