US 7,462,801 B1
Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
Yasuji Hiramatsu, Ibi-gun (Japan)
Assigned to Ibiden Co., Ltd., Ogaki-Shi (Japan)
Appl. No. 9/101,833
PCT Filed Nov. 14, 1997, PCT No. PCT/JP97/04168
§ 371(c)(1), (2), (4) Date Jan. 29, 1999,
PCT Pub. No. WO98/22252, PCT Pub. Date May 28, 1998.
Claims priority of application No. 08-326091 (JP), filed on Nov. 20, 1996; application No. 08-326092 (JP), filed on Nov. 20, 1996; application No. 08-358910 (JP), filed on Dec. 27, 1996; and application No. 08-358911 (JP), filed on Dec. 27, 1996.
Int. Cl. B23K 26/38 (2006.01); B23K 26/03 (2006.01); B23K 26/40 (2006.01)
U.S. Cl. 219—121.7  [219/121.71; 219/121.83] 19 Claims
OG exemplary drawing
 
1. A multilayer printed wiring board manufacturing apparatus comprising:
a processing laser source configured to emit a laser beam;
a scanning head configured to deflect the laser beam in X-Y directions;
an X-Y table configured to hold a multilayer printed wiring board placed thereon, the multilayer printed wiring board having an interlayer resin insulator and at least one positioning mark;
a camera configured to measure a position of the at least one positioning mark by detecting light reflected by the at least one positioning mark through the interlayer resin insulator; and
a control apparatus having an input section to which processing data of the multilayer printed wiring board is input, an arithmetic operating section configured to correct the processing data based on the position of the at least one positioning mark and generate drive data for controlling at least one of the X-Y table and the scanning head to apply the laser beam to the multilayer printed wiring board and form a hole in the interlayer resin insulator, and a memory section configured to store the processing data and the drive data.