NIST CNST NanoFab Equipment
Post Process
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Certain commercial equipment, and software, are identified in this documentation to describe the subject adequately. Such identification does not imply
recommendation or endorsement by the NIST, nor does it imply that the equipment identified is necessarily the best available for the purpose.
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Applications:
- Full wafer dicing
- Auto cutting and semi-auto cutting modes
- Used to dice silicon, sapphire, ceramic, metals, Pyrex, glass, epoxy substrates.
- Maximum material thickness < 0.50 in
- Used for dicing photomasks, wafers, creating channels, troughs, gratings, ramps and sample preparation.
Sample Size: Pieces up to 8" wafers
Restrictions: Approved training required.
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Applications:
- Wedge bonder
- Semi-automatic and manual modes
- Independent Z-axis control, separate from X and Y axis control
- Force, power and time independently adjustable on each bond
- Auto step back with motorized Y stage for precise wire length and loop formation
- Wire sizes 18-75 microns (0.0007-0.003") diameter, gold and aluminum
- Ribbon sizes up to .001"x.010" (gold)
- Electrical access to micro- and nano-devices, micro-electronic packaging
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This system utilizes CO2 to dry fragile suspended and floating structures
Applications: This tool, when used for the CO2 dry release after wet etching, provides the most beneficial process for
reducing stiction and increasing yield of suspended and floating structures
Demonstrated use:
MEMS drying, Membrane drying
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Online: February 2006
Last Updated: September 2008
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