| US 7,375,286 B2 | ||
| Printed circuit board and manufacturing method thereof | ||
| Mitsuru Honjo, Ibaraki (Japan) | ||
| Assigned to Nitto Denko Corporation, Osaka (Japan) | ||
| Filed on Mar. 21, 2007, as Appl. No. 11/688,899. | ||
| Claims priority of application No. 2006-101784 (JP), filed on Apr. 03, 2006. | ||
| Prior Publication US 2007/0227764 A1, Oct. 04, 2007 | ||
| Int. Cl. H05K 1/03 (2006.01) | ||
| U.S. Cl. 174—255 [174/250; 174/254; 174/261; 428/209; 428/210; 439/260; 361/792; 361/793; 361/794; 361/795] | 8 Claims |
| 1. A printed circuit board, comprising:
an insulating layer;
a plurality of wiring patterns formed at prescribed intervals on one surface of said insulating layer;
a thin metal film formed on the other surface of said insulating layer; and
a plurality of ground patterns formed at prescribed intervals on said thin metal film and having a thickness larger than that
of said thin metal film,
said plurality of ground patterns being provided to be opposed to regions between said plurality of wiring patterns with said
insulating layer and said thin metal film interposed therebetween.
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