| Bibliographic Citation | |
| Full Text |  5 Mb |
|---|---|
| Title | Development of a new Pb-free solder: Sn-Ag-Cu |
| Creator/Author | Miller, C.M. |
| Publication Date | 1995 Feb 10 |
| OSTI Identifier | OSTI ID: 208383; Legacy ID: DE96006802 |
| Report Number(s) | IS-T--1728 |
| DOE Contract Number | W-7405-ENG-82 |
| Other Number(s) | Other: ON: DE96006802 |
| Resource Type | Thesis/Dissertation |
| Resource Relation | Other Information: TH: Thesis (Ph.D.); PBD: 10 Feb 1995 |
| Research Org | Ames Lab., IA (United States) |
| Sponsoring Org | USDOE, Washington, DC (United States) |
| Subject | 36 MATERIALS SCIENCE ;32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION ;42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; TIN BASE ALLOYS; WETTABILITY; SILVER ALLOYS; COPPER ALLOYS; LEAD; TOXICITY; METALLURGICAL FLUX; POLLUTION ABATEMENT; ELECTRONIC CIRCUITS; SOLDERING; ANNEALING; MICROSTRUCTURE; THERMODYNAMIC PROPERTIES |
| Description/Abstract | With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed. |
| Country of Publication | United States |
| Language | English |
| Format | Medium: P; Size: 94 p. |
| Availability | OSTI as DE96006802 To purchase this media from NTIS, click here |
| System Entry Date | 2008 Feb 04 |
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Last Updated: 03/16/2009