| US 7,470,295 B2 | ||
| Polishing slurry, method of producing same, and method of polishing substrate | ||
| Dae Hyung Kim, Gyeonggi-Do (Korea, Republic of); Seok Min Hong, Gyeonggi-Do (Korea, Republic of); Jae Hyun Jeon, Gyeonsangbuk-Do (Korea, Republic of); Ho Seong Kim, Gyeonggi-Do (Korea, Republic of); Hyun Soo Park, Gyeonggi-Do (Korea, Republic of); Un Gyu Paik, Seoul (Korea, Republic of); Jae Gun Park, Gyeonggi-Do (Korea, Republic of); and Yong Kuk Kim, Seoul (Korea, Republic of) | ||
| Assigned to K.C. Tech Co., Ltd., Anseong-si (Korea, Republic of); and IUCF-HYU, Seoul (Korea, Republic of) | ||
| Filed on Mar. 11, 2005, as Appl. No. 11/78,538. | ||
| Claims priority of application No. 10-2004-0016943 (KR), filed on Mar. 12, 2004; and application No. 10-2004-0031279 (KR), filed on May 04, 2004. | ||
| Prior Publication US 2005/0198912 A1, Sep. 15, 2005 | ||
| Int. Cl. C09G 1/00 (2006.01); C09G 1/04 (2006.01); C09G 1/02 (2006.01) | ||
| U.S. Cl. 51—307 [51/308; 51/309; 106/3] | 11 Claims |
| 1. A polishing slurry comprising:
polishing particles comprising:
a plurality of grains;
a plurality of primary particles formed from agglomeration of one or more of the plurality of grains; and
a plurality of secondary particles formed from agglomeration of one or more of the plurality of primary particles,
wherein the secondary particles have a median size of 50-450 nm, the primary particles have a median size of 10-300 nm and
the grains have a median size of 10-150 nm, and
wherein the polishing particles have a particle size distribution including separated first and second polishing particle
peaks representing a first group of polishing particles having a first median particle size and a second group of polishing
particles having a second median particle size greater than the first median particle size, respectively, a ratio of an area
of the first particle peak to an area of the second particle peak is 2.85 to 25.
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