| US 7,391,092 B2 | ||
| Integrated circuit including a temperature monitor element and thermal conducting layer | ||
| Hiroaki Ohkubo, Kanagawa (Japan); Yasutaka Nakashiba, Kanagawa (Japan); Naoyoshi Kawahara, Kanagawa (Japan); Hiroshi Murase, Kanagawa (Japan); Naoki Oda, Tokyo (Japan); Tokuhito Sasaki, Tokyo (Japan); and Nobukazu Ito, Tokyo (Japan) | ||
| Assigned to NEC Electronics Corporation, Kawasaki, Kanagawa (Japan); and NEC Corporation, Tokyo (Japan) | ||
| Filed on Mar. 24, 2005, as Appl. No. 11/88,995. | ||
| Claims priority of application No. 2004-101098 (JP), filed on Mar. 30, 2004. | ||
| Prior Publication US 2005/0218471 A1, Oct. 06, 2005 | ||
| Int. Cl. H01L 31/058 (2006.01) | ||
| U.S. Cl. 257—467 [257/468] | 18 Claims |
| 1. An integrated circuit device comprising:
a temperature monitor element which is connected between two wires and whose electric resistance changes according to a temperature;
and
a thermal conducting layer containing a metal and/or an alloy provided at least one of above and under said temperature monitor
element and overlying a region one of equal to and greater than a half of said temperature monitor element as seen from a
direction perpendicular to a top surface of said temperature monitor element,
wherein said thermal conducting layer provides a uniform temperature to said temperature monitor element.
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