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In many future NASA missions--such as deep-space exploration,
the National AeroSpace Plane, minisatellites, integrated engine
electronics, and ion or arcjet thrusters--high-power electrical
components and systems must operate reliably and efficiently in
high-temperature environments. Such high-temperature electronics
will not only provide tolerance to hostile environments, but will
reduce system size and weight by eliminating radiators and thereby
reducing launch costs, improving reliability and lifetime, and
increasing energy densities. High-temperature electronic components
will also have a great influence in terrestrial applications,
such as well logging, the automotive industry, nuclear power,
and industrial processing plants.
State-of-the-art power components are limited to a maximum operating
temperature of 105 °C, with some devices functioning at temperatures
to 150 °C. The high-temperature power electronics program at the
NASA Lewis Research Center focuses on dielectric and insulating
material research, the development and characterization of high-temperature
components, and the integration of the developed components into
a demonstrable 200 °C power system--such as an inverter.
NASA Lewis has developed high-temperature power components through
collaborative efforts with the Air Force Wright Laboratory, Northrop
Grumman, and the University of Wisconsin. Ceramic and film capacitors,
molypermalloy powder inductors, and a coaxially wound transformer
were designed, developed, and evaluated for high-temperature operation.
Preliminary testing of these components has demonstrated stable
operation from 20 to 200 °C in the frequency range of 50 Hz to
100 kHz. Limited life testing also has been performed on some
of these components under simultaneous electrical and thermal
stressing. The components will eventually be integrated into a
power system that can operate at high temperatures, such as an
inverter.
Overton, E.; Baumann, E.D.; and Myers, I.T.: Thermal Aging Effects on the Electrical Properties of Film and Ceramic Capacitors. Presented at the Electrical/Electronics Insulation Conference, Chicago, IL, Oct. 1993.
Overton, E., et al: Effects of Combined Stressing on the Electrical
Properties of Film and Ceramic Capacitors. IEEE International
Symposium on Electrical Insulation, Pittsburgh, PA, June 1994.
Previous articleLast updated April 30, 1997
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