| US 7,393,771 B2 | ||
| Method for mounting an electronic part on a substrate using a liquid containing metal particles | ||
| Hiroshi Hozoji, Hitachiohta (Japan); Toshiaki Morita, Hitachi (Japan); and Hiroshi Sasaki, Mito (Japan) | ||
| Assigned to Hitachi, Ltd., Tokyo (Japan) | ||
| Filed on Nov. 24, 2004, as Appl. No. 10/996,038. | ||
| Claims priority of application No. 2004-190639 (JP), filed on Jun. 29, 2004. | ||
| Prior Publication US 2006/0267218 A1, Nov. 30, 2006 | ||
| Int. Cl. H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—610 [257/779; 257/E23.112] | 13 Claims |
| 1. An electronic part mounting method, comprising:
coating a metal paste comprised of a liquid containing metal particles that have an average particle size of 1 to 50 nm, on
a substrate having an electrode;
then drying the metal paste by heating the liquid containing the metal particles after the coating step, thereby forming an
area made of aggregated metal particles on the electrode surface layer; and
cooling said substrate after the heating step, placing an electronic part on said area made of the aggregated metal particles,
and reheating said area at 50 to 300° C. to bond the metal particles and said electronic part, thereby electrically connecting
said electrode on said substrate and said electronic part.
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