| US 7,369,720 B2 | ||
| Optical device | ||
| Takafumi Yokino, Hamamatsu (Japan); and Katsumi Shibayama, Hamamatsu (Japan) | ||
| Assigned to Hamamatsu Photonics K.K., Shizuoka (Japan) | ||
| Filed on Jun. 20, 2006, as Appl. No. 11/455,934. | ||
| Claims priority of application No. P2005-182497 (JP), filed on Jun. 22, 2005. | ||
| Prior Publication US 2007/0009199 A1, Jan. 11, 2007 | ||
| Int. Cl. G02B 6/12 (2006.01) | ||
| U.S. Cl. 385—14 | 18 Claims |
| 1. An optical device comprising:
a semiconductor optical element; and
an optical waveguide substrate having a core portion extending in a direction crossing a layer thickness direction and an
optical waveguide layer containing a clad portion covering the core portion, an end face of the core portion that is optically
coupled to the semiconductor optical element being provided to the side surface of the optical waveguide substrate, wherein
the optical waveguide substrate further has first and second substrates disposed so that the principal surfaces thereof are
facing each other,
the optical waveguide layer is provided between the first substrate and the second substrate,
the semiconductor optical element is disposed on a mount area of the side surface of the optical waveguide substrate,
the mount area contains the end face of the core portion, a part of the side surface of the first substrate and a part of
the side surface of the second substrate, wherein the mount area is contained in the bottom surface of a recess portion formed
on the side surface of the optical waveguide substrate.
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