Bibliographic Citation
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Title | Ion chromatography in the manufacture of multilayer circuit boards |
Creator/Author | Smith, R.E. |
Publication Date | 1990 Jan 01 |
OSTI Identifier | OSTI ID: 5109966; DE90005560 |
Report Number(s) | KCP-613-4247;CONF-900159--1 |
DOE Contract Number | AC04-76DP00613 |
Resource Type | Conference |
Specific Type | Technical Report |
Resource Relation | Ion chromatography in the semiconductor, electronics and plating industries; 16 Jan 1990; San Jose, CA (USA); DOE Project |
Research Org | Allied-Signal Aerospace Co., Kansas City, MO (USA). Kansas City Div. |
Sponsoring Org | DOE/DP |
Subject | 426000 -- Engineering-- Components, Electron Devices & Circuits-- (1990-) ;400105 -- Separation Procedures; PRINTED CIRCUITS-- PROCESS SOLUTIONS;PROCESS SOLUTIONS-- CHROMATOGRAPHY; AMMONIUM FLUORIDES;ANIONS;CHROMIC ACID;COPPER;PROCESSING;TRANSITION ELEMENTS |
Related Subject | AMMONIUM COMPOUNDS;CHARGED PARTICLES;CHROMIUM COMPOUNDS;DISPERSIONS;ELECTRONIC CIRCUITS;ELEMENTS;FLUORIDES;FLUORINE COMPOUNDS;HALIDES;HALOGEN COMPOUNDS;HYDROGEN COMPOUNDS;INORGANIC ACIDS;IONS;METALS;MIXTURES;OXYGEN COMPOUNDS;SEPARATION PROCESSES;SOLUTIONS;TRANSITION ELEMENT COMPOUNDS;TRANSITION ELEMENTS |
Description/Abstract | Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards.^Unlike other chemical quantification techniques, IC provides results on ions not expected in the production solutions.^Thus, solution contamination and break-down products can be monitored in every phase of the circuit board manufacturing.^During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride.^Following a wet-blasting to roughen up the surface, 20 microinches of copper are deposited using an electroless bath.^Again, IC is applicable for monitoring formate, tartarate, and sulfate levels.^Next, an acid copper bath is used to electroplate the through holes with 0.001 inches of ductile copper.^This bath is analyzed for trace chloride.^Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride.^Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy.^This bath is analyzed for fluoroborate, tin, and lead.^In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.^11 refs., 7 figs. |
Country of Publication | United States |
Language | English |
Format | Pages: (16 p) |
Availability | NTIS, PC A03/MF A01 - OSTI; GPO Dep. |
System Entry Date | 2001 May 13 |
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