US 7,393,461 B2 | ||
Microetching solution | ||
Kesheng Feng, 269 Spruce St., Cheshire, Conn. 06410 (US); Nilesh Kapadia, 71 Coram Rd., Shelton, Conn. 06484 (US); and Steve Castaldi, 134 Farmstead La., Torrington, Conn. 06790 (US) | ||
Filed on Aug. 23, 2005, as Appl. No. 11/209,471. | ||
Prior Publication US 2007/0051693 A1, Mar. 08, 2007 | ||
Int. Cl. B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); C25F 3/00 (2006.01) |
U.S. Cl. 216—106 | 17 Claims |
1. A method of roughening a copper or copper alloy surface to provide improved adhesion of a layer subsequently applied thereto, comprising contacting the copper or copper alloy surface with a microetching composition comprising a cupric ion source, a pyridine derivative, multiethyleneamine, and an acid in an amount and for a period of time to roughen the surface. |