Document Title: ISL ORC Request Created: 17-Dec-00 Last Modified: 21-Dec-00 Contact: Doug Glenzinski, douglasg@fnal.gov, x8095 Purpose: We are submitting this document as part of the request for Operational Readiness Clearance (ORC) to operate the ISL detector in the CDF collision hall starting end-January 2001. Procedure: The ISL ORC has been sub-divided into the various sub-systems required to safely operate the detector in the CDF collision hall. The DAQ, power supplies and cables, portcard, cooling, and interlocks and control sub-systems will be reviewed separately. This note describes those cables and electronic boards not covered in these documents. Once each of the sub-systems and the components described in this note have been granted ORC, it will be considered that the ISL is cleared for operation in the CDF collision hall. Review: The ISL is a large radius (r=20-30 cm) silicon detector and is part of the CDF Run2 upgrade. It is scheduled to be installed into CDF, along with the SVX and L00 silicon detectors, in middle January of 2001. The SVX, L00 and ISL detectors share the same DAQ, cooling, interlock, power and control architectures. Each of these sub-systems are pursuing an ORC (covering all three silicon detectors) with the relevant committees . The differences among the three projects are mainly internal to the tracking volume as the geometry and demands of each detector require custom cables and electronics boards. This note describes those cables and boards which are unique to the ISL. These will be reviewed by the relevant ORC committee and the CDF PCB Safety Review Board. ======================================================================== * ISL Fast HDI =============== > Description Manufacturer: Custom designed at UCD. Fabricated by AllFlex/HI. Assembled at HI and All Flex Cable Type : Cu-Kapton flex cable, 0.5 oz or 1 oz Copper traces on 3 : mil thick kapton with a 1 mil thick cover layer. Function : Delivers power for backend SVX3D chip functions from the : SVXII portcard to the gangcard. Transmits data from the : SVX3D chip back to the portcard. Length : 20 to 110 cm. Connectors : SAMTEC P/N SFMC-117-L1-SD, FTSH-117-01-L-D > Fire Safety Flame test rating : The cu kapton is called "pyralux" (made by DuPont) : and is rated to operate up to 400 C. Insulation Material: Kapton > Electrical Considerations Trace Width Max. Max. Pin # Signal Name (at narrowest) Voltage Current ------ ------------- ------------ -------- ------- 1 DVDD 30 mil 8.0 V 2A/2 conductors 2 DVDD 30 mil 8.0 V 2A/2 conductors 3 DGND 30 mil 0.0 V 2A/2 conductors 4 DGND 30 mil 0.0 V 2A/2 conductors 5 FECLK 10 mil 5.0 V 10 mA 6 FECLKBar (same for all the rest, which are LV 7 BECLK differential signal/control lines) 8 BECLKBar 9 OBDV 10 OBDVBar 11 Bus0 12 Bus0Bar 13 Bus1 14 Bus1Bar 15 Bus2 16 Bus2Bar 17 Bus3 18 Bus3Bar 19 Bus4 20 Bus4Bar 21 Bus5 22 Bus5Bar 23 Bus6 24 Bus6Bar 25 Bus7 26 Bus7bar Power conductor overcurrent protection: fused at power supply as well as hardware and software trip protection. > Contact persons: Bill Caskey, caskey@physics.ucdavis.edu Gary Grim, gpgrim@physics.ucdavis.edu. =========================================================================== * ISL Slow HDI =============== > Description Manufacturer: Custom designed at UCD. Fabricated by AllFlex/HI. : Assembled at AllFlex/HI. Cable Type : Cu-Kapton flex cable, 0.5 oz 1 oz Copper traces on 3 mil : thick kapton with a 1 mill kapton coverlay. Function : Delivers power for frontend SVX3D chip functions from the : SVXII portcard to the gangcard. Transmits control signals : for the SVX3D chip. Length : 20 to 110 cm. Connectors : SAMTEC P/N SFMC-115-L1-S-D and FTSH-115-01-L-D > Fire Safety Flame test rating: Same as the ISL Fast HDIs above - rated to 400 C. Insulation Material: Kapton > Electrical Considerations Trace Width Max. Max. Pin # Signal Name (at narrowest) Voltage Current ------ ------------- ------------ -------- ------- 1 HV1+ 10 mil 100.0 V 5mA 2 HV1- 10 100.0 V 5mA 3 HV2+ 10 100.0 V 5mA 4 HV2- 10 100.0 V 5mA 5 AVDD 30 10.0 V 2A/2 conductors 6 AVDD 30 10.0 V 2A/2 conductors 7 AGND 30 0.0 V 2A/2 conductors 8 AGND 30 0.0 V 2A/2 conductors 9 PARST 8 mil 5.O V 10 mA 10 PARST (same for all the rest which are LV 11 PARSTBar differential control lines) 12 PRD1 13 PRD1Bar 14 PRD2 15 PRD2Bar Power conductor overcurrent protection: fused at power supply as well as hardware and software trip protection. High Voltage conductor rating: High-voltage traces are separated by at least .010 inches from all other traces. This will withstand a voltage of up to 500V, per IPC guidelines. NOTE: All of the traces are effectively at the same seperation. I am rating all of the components under the worst case scenario. This is at the connector pads where the copper is exposed to air. Everywhere else the copper is insulated with either LPI or a Kapton cover layer and therefore will have a much higher rating. The pad seperations are all 15 mil but I am being conservative with just stating it at 10 mil. Connector rating is: 5.3A at 80 C, temps from -65-->125 C 750VAC. NOTE that we use multiple pins to carry the Current through the connector. The single pin current rating is 2 A. This then become 2* 4(pins each supply) * a 2/3 derating. Contact persons: Bill Caskey, caskey@physics.ucdavis.edu Gary Grim, gpgrim@physics.ucdavis.edu. =========================================================================== * ISL Gang Card ================ > Description Manufacturer: Custom designed at UCD. Fabricated at Sierra Proto : Express and assembled at Cirexx. Board Type : Multi-layer PCB. Function : Connects two ISL modules to one HDI pair. Dimensions : Approximately 2x5" Location : Mounted on ISL spaceframe flanges at ends of ISL modules. Connectors : SAMTEC P/N SFMC-115-L1-S-D and SFMC-117-L1-S-D > Fire Safety Flame test rating: Substrate Material: FR4 > Electrical Considerations: Max current: The design of traces on the board exceeds the current : carrying capabilities of the connector pins. Power conductor overcurrent protection: fused at power supply as well as hardware and software trip protection. High voltage conductor rating: Same as for the ISL Slow HDIs. > Contact persons: Bill Caskey, caskey@physics.ucdavis.edu Gary Grim, gpgrim@physics.ucdavis.edu. =========================================================================== * ISL Hybrid Pigtail ==================== > Description Manufacturer: custom designed at LBNL. Fabricated by Lenthor Engineering; assembled at Advanced Micro Assembies and LBNL Material : copper kapton laminate with 0.5 oz copper and 1 mil kapton plus 1 mil cover layer. Function : services ISL hybrid board with power and control signals and distributes HV. Dimensions : approx 1 x 3 inches Location : soldered only the ISL hybrid boards internal to the ISL detector volume; mates with the ISL gangcards Connectors : Samtec FTSH-130-01-L-D-RA. > Fire Safety: Flame test rating : The cu kapton is called "pyralux" (made by DuPont) and is rated to operate up to 400 C. Insulation Material: Kapton > Electrical considerations: signal line minimum width is 5 mils. power line minimum width is 30 mils Max currents on power are 2A but are shared over multiple lines and on control/data are 10 mA. Multiple pins used on power and ground connections. Not in excess of maximums for this technology. HV holdoff tested on all parts at 200V which is 100 V above required maximum.. No part failed HV test. High Voltage conductor rating: High-voltage traces are separated by at least 0.010 inches from all other traces. This will withstand a voltage of up to 500V, per IPC guidelines. Connector rating: 1.75A per pin at 80 C, temps from -65-->125C 750VAC. > Contact person: Carl Haber chaber@lbl.gov =========================================================================== * ISL Hybrid Board ================= > Description Manufacturer: custom designed at LBNL. Fabricated by Promex Industries. Assembled at Advanced Micro Assembies and LBNL Material: thick film gold and dielectric on Aluminium Nitride substrate. Pt/Pd/Au solder pads. Included soldered on SMT components. Aluminium oxide fanout component mounted on both sides. Metallized with thin film Aluminium Function: services SVX3D chips with power and control signals. Distributes HV to silicon sensors Dimensions: 2.5 x 2.5 inches Connectors: ISL Hybrid pigtial cable soldered on > Fire Safety: Hybrid not flammable. Small plexiglas cover is mounted over the transceiver chip. > Electrical considerations: Max currents on power are 2A and on control/data are 10 mA. Not in excess of maximums for this technology. HV holdoff tested on all parts at 200 V which is 100 V above required maximum. All HV components rated at 500 V. No part failed HV test. All boards were burned-in for 72 hours at max current and voltages both before and after connecting to a silicon sensor. > Contact person: Carl Haber chaber@lbl.gov =========================================================================== * ISL Thumb Card ================ > Description Manufacturer: Custom designed at LBNL. Fabricated at Sierra Proto : Express and assembled at Cirexx. Board Type : Multi-layer PCB. Function : Carries HV from junction card to portcard. Dimensions : Approximately 0.5x1" Location : plugs into portcard at end of ISL. Connectors : SAMTEC P/N FTSH-103-03-L-DV > Fire Safety Flame test rating: Substrate Material: FR4 > Electrical Considerations: Max current: The design of traces on the board exceeds the current : carrying capabilities of the connector pins. Power conductor overcurrent protection: fused at power supply as well as hardware and software trip protection. High voltage conductor rating: Same as for the ISL Slow HDIs. > Contact persons: Carl Haber, chaber@lbl.gov ======================================================================== * ISL Mezzanine Card ==================== > Description Manufacturer: Custom designed at UCD. Fabricated at Sierra Proto : Assembled at LBL. Board Type : Multi-layer PCB. Function : Connects slow HDI to portcard. Dimensions : Approximately .5x1" Location : Mounted on slow HDI. Connectors : ELCO**************************??? > Fire Safety Flame test rating: Substrate Material: FR4 > Electrical Considerations: Max current: The design of traces on the board exceeds the current : carrying capabilities of the connector pins. Power conductor overcurrent protection: fused at power supply as well as hardware and software trip protection. High voltage conductor rating: Same as for the ISL Slow HDIs. > Contact persons: Bill Caskey, caskey@physics.ucdavis.edu Gary Grim, gpgrim@physics.ucdavis.edu. ========================================================================