| US 7,335,063 B2 | ||
| High speed, high density electrical connector | ||
| Thomas S. Cohen, New Boston, N.H. (US); Brian Kirk, Amherst, N.H. (US); and Marc B. Cartier, Jr., Dover, N.H. (US) | ||
| Assigned to Amphenol Corporation, Wallingford, Conn. (US) | ||
| Filed on Dec. 07, 2006, as Appl. No. 11/635,090. | ||
| Application 11/635090 is a continuation of application No. 11/183564, filed on Jul. 18, 2005, granted, now 7,163,421. | ||
| Claims priority of provisional application 60/695705, filed on Jun. 30, 2005. | ||
| Prior Publication US 2007/0218765 A1, Sep. 20, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01R 13/648 (2006.01) | ||
| U.S. Cl. 439—608 [439/108] | 21 Claims |
| 1. A wafer for an electrical connector having a plurality of wafers, the wafer comprising:
a housing comprising a first, insulative housing and a second, conductive housing; and
a plurality of signal strips disposed within the first, insulative housing, the first, insulative housing comprising an insulative
material securing the plurality of signal strips and spacing the plurality of signal strips from the second, conductive housing;
wherein the second, conductive housing is formed of a non-conductive binder material having conductive particles associated
therewith, thereby rendering the second, conductive housing conductive, the second, conductive housing configured and arranged
relative to the plurality of signal strips to shield at least some of the plurality of signal strips to reduce or eliminate
electrical noise, the second conductive portion being discontinuous.
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