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Contents Preface Acknowledgements Dedication Chapter 1 Reinforcement Materials 1.0 Reinforcement Materials-Rigid 1.1 Glass 1.2 Glass Composition 1.2.1 D-Glass 1.2.2 E-Glass 1.2.3 S-Glass 1.2.4 Quartz 1.3 Fiber Glass Manufacturing 1.4 From Yarn to Fabric 1.5 Glass Types and Construction 1.6 Glass Fabric Weave 1.6.1 Plain Weave 1.6.2 Twill Weave 1.6.3 Long Shaft Satin 1.6.4 Basket Weave 1.6.5 Leno Weave 1.7 Surfacing Mat, Paper or Veil 1.8 Glass Fiber Paper 1.9 Quartz 1.10 Property of Glass Fabrics 1.10.1 Moisture and Chemical Resistance 1.10.2 Electrical Properties 1.10.3 Heat and Fire Resistance 1.10.4 Thermal Conductivity 1.11 Aramids 1.11.1 Non-Woven Aramids (Thermount) 1.12 Constraining Core Materials (Kevlar) Chapter 2 Resins 2.0 Introduction 2.1 Polyester Resin 2.2 Epoxy Resin 2.2.1 Difunctional Epoxy 2.2.2 Multifunctional Epoxy 2.2.2.1 Multifunctional Epoxy Can Be Broken Down Into Three Categories 2.2.2.1.1 General Purpose Systems Having a Tg Between 135-145OC 2.2.2.1.2 Higher Performance Multifunctional Epoxies With a Tg Between 150-165OC 2.2.2.1.3 High Temperature Multifunctional Epoxy With a Tg Between 170-185OC 2.2.3 Tetrafunctional Epoxy 2.2.4 Curing Agent 2.2.5 High Tg Epoxy 2.3 Polyimide 2.3.1 Epoxy Blended Polyimide 2.4 Cyanate Ester and Cyanate Ester Blends (BT Rein) 2.4.1 Cyanate Ester Resins 2.5 Polyphenylene Oxide (PPO) Epoxy Blends 2.5.1 Getek® Resins 2.6 Polyetherimide Resin (PEI) 2.7 Polytetrafluoroethylene Resin (PTFE) Chapter 3 Flexible Films 3.0 Introduction 3.1 Types of Flexible Films 3.1.1 Polyethylene Terepthalate [(PET) Polyester)] 3.1.1.1 Polyester/Epoxy 3.1.2 Polyethylene Naphthalate (PEN) 3.1.3 Fluorocarbons (FEP) 3.1.4 Polyiimide 3.1.4.1 Tear Resistance 3.1.4.2 Dimensional Stability 3.1.5 Aramid 3.2 Adhesive 3.2.1 Types and Use of Adhesive 3.2.2 Coating Process (Adhesive) 3.2.2.1 Major Adhesive Types 3.2.2.1.1 Epoxy Adhesive 3.2.2.1.2 Polyester Adhesive 3.2.2.1.3 Acrylic Adhesive 3.2.2.1.4 Polyimide Adhesive 3.2.2.1.5 Butyl Phenolic 3.2.3 Adhesiveless Systems 3.2.3.1 Adhesiveless Laminates 3.2.3.1.1 Cast to Foil 3.2.3.1.2 Vapor Deposition 3.2.3.1.3 Direct Vapor/Sputter Metallization 3.2.3.1.4 Plated on Film 3.2.4 Adhesiveless Properties 3.2.4.1 Electrical Advantages 3.2.4.2 Mechanical Advantages 3.2.4.3 Thermal Advantages 3.3 Covercoat/Coverlay 3.4 Bondplies 3.5 Conductive Materials 3.5.1 Electrodeposited Copper (ED) 3.5.2 Rolled Annealed Copper (RA) 3.6 Copper Clad Laminates Chapter 4 Copper Foils 4.0 Introduction 4.1 Electrodeposited Copper Foils 4.2 Rolled Copper Foils 4.2.1 Fabricating Rolled Copper Foils 4.2.2 Foil Treatment 4.2.2.1 Heat Treatment 4.2.2.2 Foil Processing 4.3 Grades 4.3.1 Electrodeposited 4.3.1.1 Grade 1 or Standard Electrodeposited (STD-Type E) 4.3.1.2 Grade 2 or High Density Electrodeposited Foils (HDE Type E) 4.3.1.3 Grade 3 or High Temperature Elongation Foil (HTE Type E) 4.3.1.4 Grade 4 Annealed Electrodeposited or ¿Super High Duct (ANN Type E) 4.3.2 Rolled Copper Foils 4.3.2.1 Grade 5 As Rolled Wrought Copper (AR Type W) 4.3.2.2 Grade 6 or Light Cold Rolled-Wrought (LCR-Type W Special Temper) 4.3.2.3 Grade 7 or Rolled Annealed Wrought (ANN Type W) 4.3.2.4 Grade 8 or As Rolled Wrought Low Temperature Anneale (Type LTA) 4.2.3 Properties 4.2.4 Application 4.3 Nickel Foils Chapter 5 Laminates Rigid 5.0 Introduction 5.1 NEMA Grades 5.1.1 Paper Based Laminates 5.1.2 Types of Laminates 5.1.2.1 XPC 5.1.2.2 XXXPC 5.1.2.3 FR-1 5.1.2.4 FR-2 5.1.2.5 FR-3 5.1.3 Properties, Construction and Specifications (Paper Based Laminates) 5.1.4 Processing Paper Grade Laminates 5.2 Composite Laminates 5.2.1 Reinforcing Mats 5.2.1.1 Surfacing Mats, Paper or Veil 5.2.1.2 Glass Fiber ¿Paper¿ 5.2.1.3 Polyester Glass mat 5.2.2 Types of Composite Laminates 5.2.2.1 CEM-1 5.2.2.2 CEM-3 5.2.2.3 CRM-5 5.2.2.4 FR-6 5.2.2.5 Properties, Construction and Specifications (Composite Laminates 5.2.3 Storage 5.2.4 Material Recommendation 5.3 Rigid Laminates (Glass Reinforced) 5.3.1 Electrical Characteristics 5.3.2 Laminate Thickness 5.4 Laminates, Rigid Glass Reinforcement 5.4.1 Epoxy Laminates (FR-4) 5.4.1.1 Difunctional Epoxies 5.4.1.1.1 Low End Modified Difunctionals With a Tg of 135 150OC 5.4.1.1.2 High Temperature Multifunctional Epoxy, Tg Between 150-165OC 5.4.1.1.3 High Temperature Multifunctional Epoxy, Tg Between 170-190OC 5.4.2 Cyanate Ester 5.4.3 Polyimide Laminates 5.4.3.1 Polyimide/Glass 5.4.3.2 Polyimide Glass and Copper-Invar-Copper 5.4.3.3 Polyimide Quartz 5.4.4 Polyphenylene Oxide 5.4.5 Polyetherimide 5.5 Aramid Laminates 5.5.1 Epoxy Thermount® 5.5.1.1 Multifunctional Epoxy/Non-Woven Aramid Reinforcement 5.5.2 Epoxy on Woven Kevlar 5.6 Prepreg 5.6.1 Manufacturing Prepreg 5.7 Additive Laminates 5.7.1 Additive Circuitry 5.7.2 Semi-Additive Laminates 5.7.2.1 Ultra-Thin Copper Foil Clad 5.7.2.2 Unclad 5.7.2.3 Unclad or Adhesive Coated 5.7.2.4 Catalytic or Seeded Chapter 6 High Speed/High Frequency Laminates . 6.0 Introduction 6.1 High-Speed/High-Frequency Laminates 6.1.1 RF Analog Circuit Characteristics 6.1.2 Digital Circuits Characteristics 6.1.3 Two Major Classes of Reinforcements 6.1.4 Goal of Each Application Area 6.2 Thin Laminates 6.3 Resins 6.3.1 Polytetrafluoroethylene 6.3.2 Ceramic Filled Polytetrafluoroethylene 6.3.3 New Fluoropolymer Composite Materials 6.3.4 Epoxy Resin 6.4 High Frequency Laminate Designation 6.4.1 GRN Type Laminates with Glass Microfibers 6.4.1.1 GRN Type Laminate with Non-Woven Fiberglass 6.4.2 GTN Type Laminate with E-Glass 6.4.3 Type GXN Laminate with E-Glass 6.4.4 GYN Type Laminate with E-Glass 6.4.5 High Dk (6.0-10.5) Laminates with E-glass 6.4.6 Temperature Stable Dielectric Constant and Low CTE Laminate with E-Glass 6.4.7 Commercial Grade Laminates 6.5 Laminate Construction 6.5.1 Cross-Plied and Non-Cross Plied Construction (Meets Type GT) 6.6 Bonding 6.7 Dimensional Stability 6.8 Drilling Chapter 7 Metal Core and Constraining Core Materials 7.0 Introduction 7.1 Copper-Invar-Copper (CIC) 7.2 Copper-Molybdenum-Copper (CMC) 7.3 Silicone Carbide Reinforced Aluminum (SiC/Al) 7.4 Coefficient of Thermal Expansion Trade-Off¿s (CTE) Chapter 8 Appendix
Library of Congress Subject Headings for this publication:
Printed circuits -- Materials.