Image Description -  0814-2

A table is captioned "Table 2. Failure Mechanisms/Screening Methods".  It
specifies the distribution of failures and screening tests for several
failure mechanisms.  The metallization failure mechanism indicates that
it accounts for 11 percent of failures and that burn-in, internal visual,
temperature cycling, scanning electron microscope for metallization are
the applicable screen tests.  The diffusion failure mechanism accounts for
1 percent of failures and burn-in is the applicable screen test.  The
oxide faults failure mechanism accounts for 14 percent of failures and
burn-in is the applicable screen test.  The bulk failure mechanism accounts
for 3 percent of failures and stabilization bake, burn-in, and temperature
cycling are the applicable screen tests.  The surface failure mechanism
accounts for 21 percent of failures and internal visual, radiography,
PIND, constant acceleration, stabilization bake and burn-in are the
applicable screen tests.  The interconnect failure mechanism accounts for
9 percent of failures and temperature cycling, burn-in, and constant
acceleration are the applicable screen tests.  The wire bound failure
mechanism accounts for 1 percent of failures and nondestructive bond
pull, stabilization bake, temperature cycling, constant acceleration,
internal visual, burn-in, radiography, and PIND are the applicable 
screen tests.  The  package failure mechanism accounts for 40 percent
of failures and PIND, radiography, seal, external visual, temperature
cycling, and constant acceleration are the applicable screen tests.