| US 7,473,318 B2 | ||
| Cleaning unit, slit coating apparatus having the same and method of coating substrate | ||
| Sung-Ki Jung, Suwon-si (Korea, Republic of); and Ho-Min Kang, Suwon-si (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (Korea, Republic of) | ||
| Filed on Feb. 26, 2004, as Appl. No. 10/789,330. | ||
| Claims priority of application No. 10-2003-0025695 (KR), filed on Apr. 23, 2003. | ||
| Prior Publication US 2004/0213913 A1, Oct. 28, 2004 | ||
| Int. Cl. B05B 15/02 (2006.01) | ||
| U.S. Cl. 118—302 [118/300; 118/410; 238/106; 238/114; 238/568] | 15 Claims |
| 1. A cleaning unit for cleaning a slit coater for coating a substrate with a material, said cleaning unit comprising:
a body including an upper face, the upper face having a receiving recession for receiving a slit nozzle of the slit coater,
the receiving recession having a sidewall and a bottom face, the sidewall having a first injection hole, a cleaning material
being sprayed via the first injection hole; and
a cleaning member for eliminating dregs of the material attached on the slit nozzle of the slit coater, the cleaning member
covering the bottom face of the receiving recession,
wherein the slit nozzle of the slit coater includes a first inclined face, a second inclined face and a connection face connecting
the first inclined face with the second inclined face, and the cleaning member makes contact with the connection face of the
slit nozzle of the slit coater during a cleaning process.
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