Rev 5 changes wish list

The Rev 5.0 DOM MB meets IceCube requirements, as delivered to Wisconsin, as is.
Whether a suggested change is implemented depends upon combined risk factors. 
Component changes that do not require copper changes have a favorable benefit to risk ratio.
Component changes tha do require copper changes have a significantly lower benefit to risk ratio.
The list is in no particular order.
Some changes will reduce cost.
Some changes will affect manufacturability.
Some changes will affect reliability.
Some changes will affect production yield,  testing and rework.


Suggested Change
Justification
Risk
proponent
Approval
R375, should it be 243, or 249 ohms Bill of Materials Consilidation
None
gtp
Rev 5.1
R348, should it be 2.2K or 2.4K ohms Bill of Materials Consilidation None
gtp
Rev 5.1
R215 and R214  NO-LOAD Not needed
None
gtp
Rev 5.1
R357 NO-LOAD
Not needed
None
gtp
Rev 5.1
SDRAM Upgrade; double density
Save Power. Footprint compatible
None to low
gtp

Keyed connector  for TP38
http://rocky.digikey.com/WebLib/Amp/Web%20Data/640454.pdf   in 2-pin  AMP,  A19423-ND from Digi-Key
Simplify testing
None
hsm
Rev 5.1
Clean up around Solder Posts  (which ones?)
Aesthetics & manufacturability
Moderate
rhm

Change test points to surface mount resistor footprints (which ones?)
Fewer Vias.  Complexity reduction
Less convenient for probes.  Probably won't save vias
Moderate to high
rhm

Improve power plane segmentation (How?)
Noise control? Aesthetics
Manufacturability
Moderate to high
rhm

Tweak 96V net routing (How?)
Aesthetics Manufacturability
Moderage to high
rhm

Bevel corners of traces on inner layers (How should be relatively obvious)
Manufacturability & quality
low to moderate
rhm

Serial ADC U4, and U79 from Maxim to Analog Devices AD7490 16 input (2.5V ref required) or AD7265 12 input
Meet extended temperature range
Moderate to high
ek

TP3, TP4, TP6, TP7, TP14, TP15, TP16, TP17 NO-LOAD Not needed on perfect boards
None
gtp
Rev 5.1
JP16 NO-LOAD
Not needed on perfect boards None
gtp
Rev 5.1
C174 change to 130pF (?) in schematic
Documentation correction
None
gtp
Rev 5.0
Remove SMD from J10 description
Documentation correction
None
gtp
Rev 5.0
Add footprint for flasher ps load resistor
Documentation correction
Low
gtp
Rev 5.1
Change R69 from 511 to 499 1%
Component consolidation
None
gtp
Rev 5.1
Buffers/level converters on digital inputs of ATWDs
Improve margins, Reduce power, Change timing slightly
Moderate to high
bk

1K 1% Resistor from U13-3 to JP20-1
1K 1% Resistor from U14-3 to JP20-2
(package deal. If you do one, you must do both)
Improve LC transmit waveform recovery
Moderate
gtp
hy
drn
Rev 5.1
Connect U6-2 to 1.8V instead of 5V, allowing R35 to be changed from a 6.8V zener diode back into a 1K resistor. [substituting the zener for the resistor was a work-around (that I'm not pleased with)]   -  alternate solution -  use R45 to monitor TP17 in order to get an accurate maesurement of the voltage delivered to the LED
More accurate monitoring of LED voltage,  via ADC channel 14
low to moderate
gtp

Either MOVE Terminal Posts OR Replace Terminal Posts with an approved connector
Improve Integration
Moderate
Wisc
Rev 5.1
Change JP1, the ribbon cable header, to a latching connector, or an IDC header
A few anchoring holes, for a ty-wrap, would be an alterntive
Improve reliability
low
Wisc
Rev 5.1
Move termination jumper to the edge of the board
Improve flexibility
moderate
Wisc

Move A/B jumper to the edge of the board
Improve flexibility
Low
Wisc
Rev 5.1
Change 64 from Maxim part to Analog Devices ADR423BR, with removal of JU14 and JU15, and removal of C394. C392 mandatory
parts availability
low to none
gtp/jkj/jmj
Rev 5.1
Move resistor R121 close to FPGA end
signal quality
low to moderate
gtp/jmj
Rev 5.1