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Large-Scale Intelligent Composite Systems Condition-Based Maintenance (CBM) Advanced Construction Materials and Processes
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Submicron Micromachining | |||||||||||||||||||||||||||||
| Tuesday, November 16, 1999 | The concept of miniaturization, successfully pioneered in the microelectronic industry, is now being extended to other industrial sectors. The miniaturization of mechanical systems is gradually evolving under such names as micromachining, microsystems technology (MST), or microelectromechanical systems (MEMS). Though some MEMS devices are being mass-produced in sufficient quantity to justify a committed manufacturing facility, by far the largest number are being produced in small batches (10 to 1,000 units per year) in what amount to lab-scale prototype shops. In order to get the interest of large companies, which is to say to secure the economic base of this startup industry, the gap between these regimes needs to be filled. We will focus on the identification and eventual elimination of the technical and financial/economic obstacles which are now blocking the development of MEMS foundries. MEMS foundries should have the capacity to cost-effectively fabricate devices in batches of 1,000 to 500,000 per year. Any plausible model of a MEMS foundry would provide as many fabrication processes as are consistent with efficient (and again cost effective) operations management. The PM breakout sessions will focus on cross-cutting, enabling technologies for manufacturing and will try to identify the technical obstacles to the development of industrial-scale MEMS foundries. |
| 8:00 a.m. | Jack Boudreaux, NIST/ATP Welcome and Introduction |
| 8:30 a.m. | Greg Hetland, Hutchison Technology Global Industrial Challenges/Needs in the 3D Non-Contact Measurement Arena |
| 9:10 a.m. | Robert Hocken, Center for Precision Metrology, UNC Charlotte Metrology and Barriers to the Scale-up of MEMS Applications |
| 9:40 a.m. Coffee Break | |
| 9:50 a.m. | Chih-Ming Ho, Director, Center for MicroSystems Engineering, UCLA Advancements and Issues for Microfluidic Measurements |
| 10:30 a.m. | E. Patrick McCluskey, Director of Electronics Components Alliance, University of Maryland Issues in MEMS Packaging and Assembly |
| 11:10 a.m. | Paul McWhorter, Deputy Director, Microsystem Science, Technology and Components Center, Sandia National Laboratory Technical and Economic Requirements for MEMS Foundries |
| 12:00 p.m. Lunch | |
| 1:00 p.m. | Breakout Session Assignments Jack Boudreaux and Christine Platt |
| 1:30 p.m. | Breakout Sessions |
| 4:00 p.m. | Breakout Session Reports |
| 5:00 p.m. | Closing and Adjourn |
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