Table of Contents
MATERIALS IN DEVICES AS SUPERCONDUCTORS (MIDAS)
PRODUCT ASSURANCE PLAN
PREPARED BY: Original Signed by E.C. Kent
E.C. Kent, Product Assurance Engineer, Office of Mission Assurance/OSEMA
CONCURRED BY: Original Signed by C.J. Tyler
C. J. Tyler, MIDAS Acting Project Manager
APPROVED BY: Original Signed by V. William Wessel for
H. T. Garrido, Director, Office of Safety, Environmental, and
Mission Assurance
National Aeronautics and Space Administration
Langley Research Center
Hampton, VA.
June 21, 1995
NAS1-20469
LIST OF APPENDICES
Appendix Title
A MIDAS System Safety Plan
ATTACHMENTS (not all present in electronic version)
Number Title
1 LaRC MIDAS Organization
2 Configuration Change Board (LaRC Form 181)
3 Purchase Request/Purchase Order (LaRC Form 125)
4 Time/Cycle Log (LaRC Form 138)
5 Fabrication and Inspection Operations Sheet (LaRC Form 136)
6 Shop Order Traveler (LaRC Form 153)
7 Assembly History Record (LaRC Form 155)
8 Nonconformance/Failure Report (LaRC Form 143)
9 Nonconformance/Failure Report (LaRC Form 143A)
10 Bonded Stores Receipt and Requisition Log
(LaRC Form 177)
11 Bonded Stores Inventory Log (LaRC Form 150)
ACRONYMS
CCB Configuration Control Board
CCR Configuration Change Request
CG Center of Gravity
CIL Critical Items List
CM Configuration Management
CVCM Collected Volatile Condensable Materials
EIDP End-Item Data Package
FD Fabrication Division
FIOS Fabrication and Inspection Operations Sheet
FMEA Failure Modes and Effects Analysis
GIDEP Government-Industry Data Exchange Program
JSC Johnson Space Center
LaRC Langley Research Center
LHB Langley Handbook
MIDAS Materials in Devices as Superconductors
MRB Materials Review Board
MSE Mechanical Systems Engineer
MSFC Marshall Space Flight Center
NFR Nonconformance/Failure Report
NHB NASA Handbook
NSTS National Space Transportation System
OMA Office of Mission Assurance
OSEMA Office of Safety, Environmental, & Mission Assurance
PAE Product Assurance Engineer
PAI Program Assurance Instruction
PAM Product Assurance Manual
PR Purchase Request
QA Quality Assurance
QAS Quality Assurance Specialist
QAIB Quality Assurance and Inspection Branch
RBD Reliability Block Diagram
RFP Request for Proposal
STS Space Transportation System
TBD To Be Determined
TML Total Mass Loss
TPE Technical Project Engineer
1. INTRODUCTION
This Product Assurance Plan defines the requirements for configuration
management, reliability, quality assurance, parts, materials, processes,
and system safety which are applicable for design, procurement, fabrication,
assembly/disassembly, and test operations for Langley Research Center (LaRC)
deliverables through completion of the Materials In Devices As Superconductors
(MIDAS) mission. The requirements of this Plan are consistent with the
requirements of the LaRC Program Assurance Manual (PAM) 5300.1.
1.1 Classification
MIDAS is classified as a Class D experiment as defined in the requirements
of the LaRC Program Assurance Manual, LHB 5300.1, PAI 5310-1.1, which is
consistent with NMI 8010.1. The MIDAS experiment is designed to evaluate
the effects of space radiation, microgravity, electromagnetic interferences
and vibration on thick film High Temperature Superconductor (HTS) test
circuits and determine if there is any microstructural damage due to extended
exposure.
1.2 Applicability
The requirements of this Plan are applicable to all MIDAS flight hardware
and spares for the flight instrument.
1.3 Applicable Documents
The documents listed below form a part of this plan to the intent specified
herein.
LHB 5300.1 "Langley Research Center Program Assurance Requirements".
LHB 7320.1 "Engineering Drawing System".
NHB 5300.4(1D-2) "Safety, Reliability, Maintainability, and Quality
Provisions for the
Space Shuttle Program".
NHB 5300.4(3A-2) "Requirements for Soldered Electrical Connections".
NHB 5300.4(3G) "Requirements for Interconnecting Cables, Harnesses,
and
Wiring".
NHB 5300.4(3H) "Requirements for Crimping and Wire Wrap".
NHB 5300.4(3I) "Requirements for Printed Wiring Boards".
NHB 5300.4(3J) "Requirements for Conformal Coating and Staking of Printed
Wiring Boards and Electronic Assemblies".
NHB 5300.4(3K) "Requirements for Ridged Printed Wiring Boards and Assemblies
NHB 5300.4(3L) "Requirements for Electrostatic Discharge Control".
NSTS 1700.7B "Safety Policy and Requirements for Payloads Using the
Space
Transportation System".
NSTS 13830B "Implementation Procedure for NSTS Payload Safety
Requirements".
NSTS 18798 "Interpretations of NSTS Payload Safety Requirements".
NSTS 22206 "Instructions for Preparation of Failure Modes and Effects
Analysis (FMEA) and Critical Items List (CIL)".
MIL-STD-100 "Engineering Drawing Practices".
IPC-SM-782 "Surface Mount Design and Land Pattern Standard".
US/R002 "Hardware General Design Standards and Test Requirements".
(US/Russian Agreements)
1.4 Mission Success Criteria
The MIDAS experiment will have successfully accomplished its' mission if
the experiment maintains mechanical and electronic integrity from launch
through retrieval and landing and has the capability to monitor, measure,
and record temperature differences, current, and voltage data on the HTS
materials during exposure to microgravity.
1.5 Product Assurance Deliverables
The MIDAS program will have the following list of items furnished to the
Project Leader at the appropriate times. Support functions are also identified.
a. Product Assurance Plan (deliverable)
b. Drawing Review/Testing Review (support)
c. Failure Modes, Effects and Analysis Report and Critical Items List
(deliverable)
d. Reliability Report (deliverable)
e. Government Industry Data Exchange Program (support)
f. Purchase Order Review (support)
g. Receiving Inspection (support)
h. Logbooks (deliverable)
i. Limited Life Items (support)
j. Contamination Control (support)
k. Safety Analysis (deliverable)
l. Review Inputs regarding Product Assurance (deliverable)
m. End-Item Data Package (deliverable)
2. ORGANIZATION
The MIDAS Project Team Organization is shown on Attachment 1 (not included
herein). The Product Assurance Engineer (PAE) is responsible for assuring
the overall implementation of the requirements of this Plan consistent
with the intent of the Product Assurance Instruction (PAI) 5300.1 "Program
Assurance: General Policy, Responsibility, Authority, and Implementation".
3. RELIABILITY AND DESIGN SPECIFICATION
3.1 Reliability Assessment
The following reliability analysis will be performed in accordance with
the methods established in PAI 5310-2.1 to assure the MIDAS hardware will
meet the mission success criteria..
3.1.1 Reliability Logic Block Diagram (RBD)
The RBD will illustrate interdependence between subsystem components so
functional failure can be traced. It will display the various series and
redundant block combinations that result in system success. The RBD will
provide a reliability prediction for the success of MIDAS.
3.1.2 Failure Modes and Effects Analysis (FMEA)
and Critical Items List (CIL)
A FMEA and CIL will be performed in accordance with NSTS 22206 to determine
and analyze the assumed failure modes on the MIDAS flight hardware. The
failure modes and effects identified shall be documented on either LaRC
Form 151 "Failure Mode and Effects Analysis" or on the forms identified
in NSTS 22206. Flight hardware failure modes for subsystems will be analyzed
to determine higher system level effects on the flight crew and/or other
experiments. Parts level FMEA's will be performed where MIDAS failure effects
result in loss of life or STS vehicle.
3.1.3 Reliability Prediction
A reliability prediction using MIL-HDBK-217F will be performed on the MIDAS
subsystem based on available sources at the time the prediction is required.
The design life will be for a duration of three months of successful operation
following a ground testing period.
3.2 Alert Reporting Systems
The Alert Reporting System will be implemented as per PAI 5300-1.5 , "Participation
in the Government-Industry Data Exchange Program (GIDEP)". The PAE will
coordinate applicable alerts with engineering to identify and assess the
use of suspect parts and materials.
3.3 Design Specification
Design data will be reviewed to ensure that quality, reliability, and safety
considerations have been factored into the flight hardware design. The
PAE will participate in all design reviews.
4. CONFIGURATION MANAGEMENT
4.1 Hardware Configuration Management
A Configuration Management Plan shall be prepared to meet the intent of
PAI 5310-6.1 which identifies the configuration management system to accurately
define and control the configuration of flight hardware, spares, and ground
support equipment (GSE) (if applicable). The requirements for configuration
control including change control and baseline management are defined in
the Configuration Management Plan.
4.1.1 Responsibilities
The MIDAS Project Manager (or designate) shall be responsible for providing
and implementing a MIDAS Configuration Management Plan prior to fabrication
of flight hardware. The PAE and/or the Quality Assurance Specialist will
perform periodic surveys of design, fabrication, assembly, integration,
and testing phases with emphasis on verifying that the configuration is
identifiable and that changes are traceable to an established baseline
and the design drawings and hardware are in conformance.
4.1.2 Drawings
The configuration of the MIDAS design baseline is established by released
drawings, schematics and specifications at the Critical Design Audit (CDA)
and is the reference point from which the change control is implemented.
LaRC generated drawings shall be in compliance with LHB 7320.1 "Engineering
Drawing System". Drawings contractually required for submittal to LaRC
shall be in accordance with MIL-STD-100 "Engineering Drawing System."
4.2 Configuration Change Control
4.2.1 Configuration Change Request
A Configuration Change Request (CCR), LaRC Form 181 (Attachment 2), shall
be prepared for proposed changes to approved documents on the baseline
after the CDA. The CCR shall classify each change as Class I (adversely
impact cost, schedule, performance, or interface, requiring Team Leader
approval) or Class II (correction of documentation errors, addition of
clarifying notes, etc.).
4.2.2 Configuration Control Board
The Configuration Control Board (CCB) is responsible for assuring an effective,
controlled flow of design changes by identifying all changes with formal
disposition and documentation. The Board is responsible for evaluating
Class I changes and recommending their disposition to the Project Manager.
The CCB consists of members with the same working background as the Material
Review Board (MRB).
4.3 Configuration Accounting
A records system shall be maintained to provide for Class I and Class II
changes, traceability control, complete lists identifying all drawings,
specifications, assembly numbers, procedures, and plans under configuration
control.
4.3.1 Item Identification and Marking
Hardware identification will be in accordance with PAI 5310-3.4. All parts
and assemblies shall be identified by an identification number consisting
of a part number, serial number, and any applicable changes per US/R002
agreements. Methods used to identify hardware such as engraving, ink markings,
or tags will be compatible with hardware being labeled.
4.3.2 Traceability
Parts, materials, and processes will be identified on engineering drawings.
Procured hardware shall be traceable to the purchase order and lot number.
5. PROCUREMENT PROGRAM ASSURANCE
5.1 Purchase Request Review
The procurements of all flight hardware, software, and services shall be
conducted in accordance with PAI 5310-1.2 "Procurement Program Assurance".
Flight hardware, other than Electrical, Electronic, and Electromechanical
(EEE), Purchase Requests/Purchase Orders (PR/PO) , Form 125 (Attachment
3), including requisitions from stock, shall be submitted to the project
PAE for review. EEE parts procurements shall be approved by the EEE Parts
Engineer.
5.2 Receiving and Inspection
Shipping and Receiving personnel shall inspect received packages for external
damage only. Packages shall not be opened. Packages which are received
undamaged shall be delivered to the appropriate Bonded Stores area for
receiving inspection. Undamaged stock items, designated as flight hardware
shall be delivered to the Receipt Inspection/Quality Assurance Lab which
will assure that the acceptance criteria stated on the PR is met. After
acceptance, the hardware will be logged into Bonded Stores.
5.3 Acceptance/Rejection of Received Articles
Articles which do not conform to drawings, specifications, or PR acceptance
criteria and/or do not have adequate or correct data are to be documented
on a Nonconformance Report and held for the Material Review Board (MRB)
disposition.
5.4 Receipt Inspection Documentation
The documentation for articles and materials shall reference the purchase
order number, item number, supplier, part number, raw material identification
information, quantity accepted, and contain the vendors inspectors acceptance
stamp, as applicable.
5.5 Supplier Documentation
For items procured, evidence of the following required supplier inspections
and test, if applicable, shall be verified at receiving inspection:
a. Material certification test report
b. Evidence of supplier inspection acceptance
c. Certification that end-items are from material furnished.
d. Test data.
e. Inspection reports.
f. Other documentation as specified on the purchase order.
6. PARTS, MATERIAL SELECTION, AND PROCESS CONTROL
6.1 Parts
6.1.1 Electrical, Electronic, and Electromechanical
(EEE) Parts
The selection, procurement, and application of EEE parts will be performed
per PAI 5310-5. The EEE Parts Manager shall ultimately approve all EEE
parts in the MIDAS hardware and is responsible for qualification, screening,
testing, and failure analysis as required.
6.1.2 Parts Selection
Parts shall be selected which optimize design and performance. To the extent
they satisfy cost, design, and mission environment requirements, flight
parts shall be selected in the order of preference defined below:
1. Standard Grade 2 Parts.
2. Standard Grade 1 Parts.
3. Standard Parts are defined as parts selected from either of the following:
a. MIL-STD-975 "NASA Standard Electrical, Electronic, and Electromechanical
(EEE) Parts List".
b. "Goddard Space Flight Center Preferred Parts List" (latest issue).
4. Non-standard parts available to high reliability military specifications.
5. Parts available to vendor hi-rel specification.
6. Industrial or commercial grade parts.
Standard parts shall be procured to their existing military specifications.
Other parts shall be procured to the best available specifications. When
parts are not available to the adequate specification, either a unique
LaRC specification shall be generated and used for procurement or the part
will be upgraded by additional testing. Acceptable parts shall be inventoried
and placed in Bonded Stores. EEE Parts shall be controlled and traceable
to their lot/date codes.
6.1.3 MIDAS EEE Parts List
The EEE Part Engineer shall develop the MIDAS Parts List and show lot/date
codes as appropriate.
6.1.4 Fasteners
Fasteners received at LaRC will be verified by the Receiving and Inspection
Lab per MIDAS specifications. After acceptance, fasteners and certification
documentation will be maintained in Bonded Stores.
6.2 Materials
6.2.1 Materials List
A materials list shall be developed identifying material, material codes,
with the selected materials meeting the outgassing properties required
for the Collected Volatile Condensable Materials (CVCM) and Total Mass
Loss (TML) values identified in PAI 5310-5.1.
6.2.2 MIDAS Organic Materials Selection
Selected materials for printed wire boards (PWB) will meet the requirements
of JSC 09604F/MSFC-HDBK-527F "Materials Selection List for Space Hardware
Systems" for outgassing, flammability, and stress corrosion.
6.2.3 Metals
MSFC 522B "Design Criteria for Controlling Stress Corrosion Cracking" will
be the guide towards proper metals selection.
6.2.4 MIDAS Limited Life Items List
Limited life items include all hardware that is subject to degradation
because of age, operating time, or cycles such that their expected useful
life is less than twice the required life when fabrication, test, storage,
and mission operation are combined. If items have known limited life or
cycle capability in the design, they shall be noted identifying their life,
maximum operating time, or cycles. The time/cycle log data will be maintained
on the Time/Cycle Log LaRC Form 138 (Attachment 4).
7. QUALITY CONTROL
7.1 Contamination Control
The MIDAS hardware will satisfy outgassing constraints in accordance with
JSC 09604F/MSFC-HDBK-527F. All HTS materials will be maintained in a controlled
environment. The requirement for determining the level of cleanliness for
the PWB will be prepared to meet the intent of PAI 5310-3.11.
7.2 Electrostatic Discharge Control (ESD)
All ESD items shall be handled in accordance with PAI 5310-3.18 "Electrostatic
Discharge Control".
7.3 Fabrication Control
7.3.1 Workmanship Specification/Standards
The documents below shall be used to control workmanship of MIDAS hardware.
All standards shall contain appropriate product acceptance/rejection criteria.
NHB 5300.4(3A-2) "Requirements for Soldered Electrical Connections".
NHB 5300.4(3G) "Requirements for Interconnecting Cables, Harnesses,
and
Wiring".
NHB 5300.4(3H) "Requirements for Crimping and Wire Wrap".
NHB 5300.4(3I) "Requirements for Printed Wiring Boards".
NHB 5300.4(3J) "Requirements for Conformal Coating and Staking of Printed
Wiring Boards and Electronic Assemblies".
NHB 5300.4(3K) "Requirements for Ridged Printed Wiring Boards and Assemblies
NHB 5300.4(3L) "Requirements for Electrostatic Discharge Control".
IPC-SM-782 "Surface Mount Design and Land Pattern Standard".
7.3.2 Fabrication Planning and Processes
Fabrication, assembly, inspection, and in-process testing, if required,
shall be planned and documented prior to the start of fabrication. A Fabrication
Inspection and Operation Sheet (FIOS) LaRC Form 136 (Attachment 5), shall
be prepared per PAI 5310-3.17. The responsible MIDAS System Engineer
will coordinate the fabrication planning effort with the FD QAIB. The PAE
and QA Specialist shall review the plan.
7.3.3 Quality Assurance Coverage and Records
Routing and fabrication records shall be documented and maintained on a
Shop Order Traveler, LaRC Form 153 (Attachment 6), per PAI 5310-3.17 and
on an Assembly History Record, LaRC Form 155 (Attachment 7), per PAI 5310-3.16.
Fabrication records including the FIOS, Assembly History Records, Process
Records, vendor records if applicable, and nonconformance reports shall
become part of the traveler package and maintained by the Quality Assurance
Inspection Branch, Fabrication Division.
7.4 Inspection and Test
The inspection and test program shall be met with the intent of PAI 5310-3.10
to assure that the drawing and specification requirements are met and that
the quality inherent in the design is maintained.
7.4.1 Inspection and Test Planning
Planning shall be developed for inspection and test surveillance operations
to assure compliance with engineering and manufacturing requirements. Inspection
and test planning shall be developed for critical hardware by the cognizant
Test Engineer using engineering drawings, process specifications, and process
procedures. The planning shall identify the production and assembly sequence
with mandatory inspection and test points.
7.4.2 Inspection Acceptance Criteria
Acceptance criteria shall be identified for each inspection. Dimensional
or performance inspections shall reference drawings or specifications.
Process control inspections shall reference the applicable process procedures.
Visual inspections shall reference the applicable workmanship manual. Non-destructive
inspections shall also have acceptance criteria identified, if applicable.
7.4.3 Inspection Test Records
Inspection records are established throughout the manufacturing and assembly
by the Shop Order Traveler and the Assembly History Record. These records
shall be maintained with the applicable hardware. The complete Shop Order
Traveler shall contain all of the fabrication and inspection records and
become a part of the End-Item Data Package (EIDP). Test records are established
by the completed test procedure with data documented therein. These records
shall be maintained with the appropriate logbook.
7.5 Assembly and Integration
7.5.1 Assembly and Integration Procedures
Any activities involving assembly or integration of MIDAS hardware into
the next higher level of assembly shall be performed using approved written
procedures. All procedures shall be approved by the PAE or QA Specialist.
All unscheduled activities which are performed during phases for which
procedures are utilized shall be "red-lined" in the procedure and documented
in the Assembly History Record and approved by the cognizant Project Systems
Engineer and QA Specialist.
7.5.2 Logbooks
Logbooks are required for flight hardware systems and subsystems. The logbooks
are initiated by the Cognizant Project Systems Engineer and issued by the
QA Specialist per PAI 5310-3.16, "Records and Logbook System".
7.6 Nonconforming Articles and Material Control
Nonconforming materials which do not conform to applicable drawings will
be segregated and held for disposition by the Material Review Board.
7.6.1 Nonconformance/Failure Reporting
Nonconformance reporting shall start at the initiation of hardware fabrication.
Failure reporting shall start at the first application of power at the
lowest level of assembly above part level. A Nonconformance/Failure Report
(NFR), LaRC Form 143/143A (Attachment 8 and 9), shall be initiated per
PAI 5310-3.2 for nonconformances and failures of flight hardware or ground
support equipment.
7.6.2 Problem Investigation
Problem investigations will be coordinated by the appropriate quality organization
with assistance as required from support functions.
7.6.3 Material Review Board
Material Review Boards shall consist of technical representatives from
engineering, MIDAS project management, and product assurance with signature
authority to review and disposition nonconforming items. Consultants may
be contacted for input as required.
7.7 Bonded Stores
All MIDAS flight hardware shall be stored in Bonded Stores per PAI 5310-3.14.
The Bonded Stores shall be located in controlled access areas with environmental
controls. Specific cognizant engineers shall be responsible for control
of stored hardware. Flight hardware and non-flight hardware shall be segregated.
All flight hardware to be placed in Bonded Stores shall be identified and
documented on LaRC Form 177 (Attachment 10). A Bonded Stores Inventory
Log, LaRC Form 150 (Attachment 11), shall record the flight hardware received
and the location of their associated design documentation.
7.8 Metrology Control
Instruments used to measure or verify compliance to drawings and specification
requirements shall be in current calibration with evidence of calibration
contained thereon.
7.9 QA Stamp Control
Quality Status Stamps shall be used to indicate the quality status of articles,
material, and documents. Stamps shall be controlled and used as defined
in PAI 5310-3.6.
7.10 End-Item Data Package
The End-Item Data Package (EIDP) provides cognizance of the functional
characteristics, and flight worthiness of the hardware to be shipped and
subsequently maintains configuration accountability. The individual responsible
for specific disciplines will provide the required documentation listed
below to the PAE to be included in the EIDP. The EIDP will include, but
not limited to, the following documents:
1. Certification of Conformance PAE
2. NFR's, Waivers, and Deviations QA Specialist
3. Test Documentation Test Engineer
4. As-shipped Configuration Verification PAE
5. Limited Life Items Lead Engineer
6. Design Drawings Lead Engineer
7. Project Approved Parts List Lead Engineer
8. Reliability Analysis PAE
9. Instrument Operations Manual Lead Engineer
10. As-Built Parts List Lead Engineer
7.11 Handling, Preservation and Shipping
All hardware shall be protected from damage during all phases of manufacturing,
assembly, testing, shipping, and storage per PAI 5310-3.12.
8. SOFTWARE ASSURANCE
The Software Quality Assurance Plan will ensure software development in
compliance with NMI 2410.10B "NASA Software Management, Assurance, and
Engineering Policy". The software program assurance development lifecycle
will be controlled and documented to the maximum extent possible given
the maturity of the various components of the MIDAS software and related
documentation at that time.
9. SYSTEM SAFETY
System safety requirements for the MIDAS flight hardware design and flight/ground
operations will be developed and documented in accordance with NSTS 1700.7B.
All safety reviews shall be held in accordance with the phased system as
defined in NSTS 13830B. The MIDAS System Safety Plan is identified in Appendix
A.
APPENDIX A
MIDAS SYSTEM SAFETY PLAN
Last modified 7/25/02