| US 7,353,818 B2 | ||
| Apparatus and method for slicing an ingot | ||
| Eunsang Ji, Kumi (Korea, Republic of); and Kyungmoo Lee, Kumi (Korea, Republic of) | ||
| Assigned to Siltron Inc., Kumi (Korea, Republic of) | ||
| Filed on Apr. 12, 2007, as Appl. No. 11/734,773. | ||
| Application 11/734773 is a division of application No. 11/256331, filed on Oct. 21, 2005. | ||
| Claims priority of application No. 10-2004-0096218 (KR), filed on Nov. 23, 2004. | ||
| Prior Publication US 2007/0190912 A1, Aug. 16, 2007 | ||
| Int. Cl. B28D 1/06 (2006.01) | ||
| U.S. Cl. 125—16.02 [125/21; 83/651.1] | 4 Claims |
| 1. A method for slicing an ingot having a surface curvature into a plurality of wafers via a slurry while the slurry is supplied
to a moving wire, the method comprising:
slicing a first guide beam having a surface curvature substantially the same as the ingot surface curvature attached to one
side of the ingot, with the moving wire;
slicing the ingot; and
slicing a second guide beam having a surface curvature substantially the same as the ingot surface curvature attached to an
other side opposite to the one side of the ingot.
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