US 7,388,462 B2 | ||
Integrated circuit inductors | ||
Kie Y. Ahn, Chappaqua, N.Y. (US); and Leonard Forbes, Corvallis, Oreg. (US) | ||
Assigned to Micron Technology, Inc., Boise, Id. (US) | ||
Filed on Mar. 18, 2002, as Appl. No. 10/100,709. | ||
Application 10/100709 is a division of application No. 09/821240, filed on Mar. 29, 2001, granted, now 6,357,107. | ||
Application 09/821240 is a division of application No. 09/350601, filed on Jul. 09, 1999, granted, now 6,240,622. | ||
Prior Publication US 2002/0095770 A1, Jul. 25, 2002 | ||
Int. Cl. H01F 5/00 (2006.01) |
U.S. Cl. 336—200 [336/223; 336/232] | 46 Claims |
1. An inductor comprising:
a coil having a core area, the core area being an area surrounded by the coil; and
a substrate, wherein the substrate is partially coated to provide a coated substrate portion and an uncoated substrate portion,
wherein the coated substrate portion fills the core area such that a first portion of the coil at a first surface of the substrate
passes through the substrate and couples to a second portion of the coil at a second surface of the substrate, wherein a substrate
material of the coated substrate portion and a substrate material of the uncoated substrate portion are identical substrate
material, and wherein the substrate and the core area include an identical material.
|