| US 7,385,824 B2 | ||
| Processor module with rigidly coupled processor and voltage-regulator heat sinks | ||
| Stephan K. Barsun, Sacranento, Calif. (US); Brent Allen Boudreaux, Highland Village, Tex. (US); Brandon Rubenstein, Loveland, Colo. (US); Stephen Daniel Cromwell, Penryn, Calif. (US); and Eric C. Peterson, McKinney, Tex. (US) | ||
| Assigned to Hewlett-Packard Development Company, L.P., Houston, Tex. (US) | ||
| Filed on Jul. 29, 2005, as Appl. No. 11/192,736. | ||
| Prior Publication US 2007/0025088 A1, Feb. 01, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—719 [361/707; 361/709; 361/717; 361/718; 257/707] | 12 Claims |
| 1. A processor module comprising:
a carrier having pads;
a processor rigidly mounted to said carrier;
a voltage regulator with flexible contacts, said voltage regulator being mounted on said carrier so that said flexible contacts
contact said pads under compression, said carrier providing for electrical connectivity between said flexible contacts and
said processor;
means for adjusting said compression;
heat sinks respectively mounted on said processor and said voltage regulator; and
means for rigidly coupling said heat sinks so that said compression is fixed.
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