| US 7,462,880 B2 | ||
| Semiconductor light-emitting element assembly | ||
| Takuro Ishikura, Kashihara (Japan); and Tomihiro Ito, Niigata (Japan) | ||
| Assigned to Sharp Kabushiki Kaisha, Osaka (Japan) | ||
| Filed on Jul. 30, 2007, as Appl. No. 11/882,008. | ||
| Claims priority of application No. 2006-206293 (JP), filed on Jul. 28, 2006. | ||
| Prior Publication US 2008/0048204 A1, Feb. 28, 2008 | ||
| Int. Cl. H01L 29/74 (2006.01) | ||
| U.S. Cl. 257—99 [257/706] | 7 Claims |
| 1. A semiconductor light-emitting element assembly comprising:
a semiconductor light-emitting element having first and second leads, a semiconductor light-emitting element chip die-bonded
to the first lead and wire-bonded to the second lead, a metal body for heat dissipation fixed to the first and second leads
via an insulating adhesive layer, and a reflector fixed to the first and second leads and reflecting light from the chip;
a wiring board having an opening for receiving the reflector, the first and second leads being fixed to the wiring board so
that the reflector is received in the opening;
a heat dissipator disposed on the metal body for heat dissipation;
a fastening part for fastening the heat dissipator and the wiring board; and
an interval holding part provided between the heat dissipator and the wiring board, the interval holding part holding an interval
between the heat dissipator and the wiring board so that the interval is equal to or longer than a predetermined distance.
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