| US 7,328,490 B2 | ||
| Method for manufacturing a liquid jetting head | ||
| Masami Murai, Nagano-ken (Japan); and Xin-Shan Li, Nagano-ken (Japan) | ||
| Assigned to Seiko Epson Corporation, Tokyo (Japan) | ||
| Filed on Aug. 05, 2004, as Appl. No. 10/911,709. | ||
| Application 10/911709 is a division of application No. 10/348340, filed on Jan. 22, 2003, granted, now 6,883,901. | ||
| Claims priority of application No. 2002-012714 (JP), filed on Jan. 22, 2002; application No. 2002-019807 (JP), filed on Jan. 29, 2002; application No. 2002-208641 (JP), filed on Jul. 17, 2002; and application No. 2003-005116 (JP), filed on Jan. 10, 2003. | ||
| Prior Publication US 2005/0078153 A1, Apr. 14, 2005 | ||
| Int. Cl. H04R 17/10 (2006.01) | ||
| U.S. Cl. 29—25.35 [29/846; 427/100] | 4 Claims |
| 1. A method for manufacturing a piezoelectric element comprising the steps of:
forming a Ti film on a layered bottom electrode;
forming piezoelectric material layers in a plurality of cycles of layer formation to produce a PZT piezoelectric thin film
predominantly oriented in a 100 plane; and
forming a top electrode on the PZT piezoelectric thin film,
wherein, when the piezoelectric material layers are formed, an annealing temperature of an initial cycle of layer formation:
(1) is set higher than an annealing temperature of subsequent cycles of layer formation and, (2) is set higher than a temperature
at which the layered bottom electrode undergoes interdiffusion, and
wherein the annealing temperature of the subsequent cycles of layer formation is set below the temperature at which the layered
bottom electrode undergoes interdiffusion.
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